Enterprise Power and Cooling: A Chip-to-Data Center Perspective Norm Jouppi, Hewlett Packard Background Cooling: A Chip-Core to Cooling-Tower Perspective Power: From Chips to Data Centers

Enterprise Power and Cooling: A Chip-to-Data Center Perspective Norm Jouppi, Hewlett Packard Background Cooling: A Chip-Core to Cooling-Tower Perspective Power: From Chips to Data Centers Chandrakant Patel and Parthasarathy Ranganathan, HP Labs Power and cooling are increasingly becoming key challenges in enterprise environments, impacting infrastructure, electricity, and maintenance costs, as well as space, reliability, and environmental standards compliance. In the future, it will be important to address these challenges “holistically” – across the different levels of the hardware and software stacks while considering the total cost of ownership (TCO). For example, power and cooling need to be considered together along with performance and reliability, as decisions made for one influence the choices and costs for the other. Similarly, there is a need for cross-specialty solutions going beyond better adaptability in the system elements to include the operating system and the management and applications software stack. Co-ordination is also needed across the entire “ensemble” – from chips to data centers. All this will require interdisciplinary research spanning electrical engineering, computer science, and thermal science. This tutorial first provides a broad overview of the power and cooling problem in enterprise datacenters. We present recent industry trends to illustrate the problem, and then discuss current cooling and power work in the context of a unified framework from chip-core to data center. We conclude with a discussion of holistic optimizations for the problem including a detailed case study of the HP Labs Smart Data Center. Afternoon Tutorial Sunday, August 19, 2007